You are here: Wafer Level Packaging Pac Tech is the Worldwide Leading Supplier in ELECTROLESS WAFER BUMPING technology. With its volume production facilities in Germany, USA and Japan it offers a capacity of over 760 000 Wafer per year in 6', 8' and 12'. Pac Tech provides turn key Wafer bumping and Wafer level packaging solutions. This includes engineering, development of prototypes and high volume production. Pac Tech offers following technologies for wafer level packaging: Pac Tech philosophy is to integrate its leading technology developments in to volume production equipment. Pac Tech provides three equipment platforms: ELECTROLESS WAFER BUMPING and Peripheral Equipment: , Laser Assisted Solder Jetting and Die/Wafer Level Attach for Flip Chip and MEMS Packaging: Wafer Level µSolder Ball Attach, Ball Inspection and Ball Rework: Meptec Member Company Profile of Pac Tech VISIT US AT SMTA Medical Electronics 28 April Minnesota, MN RECENT PUPLICATIONS [55] Thorsten Teutsch, ENIG vs. ENEP (G) Under Bump Metallization for Lead-free WL-CSP Solder Bumps - a Comparison of Intermetallic properties Using High Speed Pull Test, Imaps International Conference on Device Packaging, (Scottsdale, Arizona), Mar. 17-20, 2008 © by Pac Tech GmbH 2008
